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Âé¶¹Çø Hosts CMPUG Conference

Âé¶¹Çø Hosts CMPUG Conference

Published: April 24, 2025.

Âé¶¹Çø hosted the 2025 Chemical Mechanical Polishing Users Group Conference on April 3-4. Over 50 in-person and 150 online researchers, engineers, and students gathered in Romeoville to discuss, “Developing the ‘Next Generation’ CMP Ecosystem.”  

Over 25 experts and students from industry and universities presented talks, poster sessions, and keynote addresses over the two-day hybrid event.  

Dr. Jason Keleher, associate professor and chair of Âé¶¹Çø’s Chemistry department, served as a co-chair for the event along with Bahar Basim of Intel, Nagella Nakuna of Dupont Electronics, Mike Pevny of 3M Company and Devon Shipp of Clarkson University. 

Formed in October 1995, the explores issues and challenges related to rapidly growing technology. CMPUG holds quarterly meetings with technical presentations on a topic of interest to further their investigation and share with their community.  

Âé¶¹Çø is a modern, enterprising, Catholic university with a growing student enrollment from GED through doctoral level programs. As part of the global Lasallian network of 65 universities, Âé¶¹Çø is known for preparing graduates who impact the world for the better. Visit www.lewisu.edu for further information.



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